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    10μF 25V Multilayer Ceramic Chip Capacitor

    Factory price SMD multilayer ceramic chip capacitor for sale, 10μF (10000000pF, 10000nF) capacitance, rated voltage 25V, 20% tolerance, 4000PCS per roll. This MLCC surface mount capacitor is widely used for household appliances, operating temperature range from -40℃ to 105℃.
    SKU: ATO-MLCC-25V106K
    This product has a minimum quantity of 10
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    Delivery date: 6-12 days

    Multilayer ceramic chip capacitor is stable and has high capacitance. Laminated monolithic structure, excellent solderability and solder resistance, MLCC capacitors are suitable for reflow and wave soldering, various filtering and coupling circuits.


    • Model: ATO-25V106K0603
    • Series: Multilayer Ceramic Chip Capacitor
    • Capacitance: 10μF (10000000pF, 10000nF)
    • Rated voltage: 25V
    • Tolerance: 20%
    • Operating Temperature Range: -40℃ - 105℃
    • Lead Type: SMD
    • Size: 16mm
    • Thickness: 0.8mm
    • Package: 4000PCS / roll
    • Application: Household Appliances
    • Medium Material: Ceramic (Porcelain)
    • Loss: 0.01%
    • Weight: 0.8kg


    Structure of MLCC multilayer ceramic capacitor

    Structure of multilayer ceramic chip capacitor

    Tips: Causes of leakage of multilayer ceramic capacitors

    1. Void
      The cavity formed by the volatilization of foreign matter inside the capacitor during the sintering process. Voids can lead to short circuits between electrodes and potential electrical failure. Larger voids not only reduce the IR, but also reduce the effective capacitance. When the power is turned on, it may cause local heating of the cavity due to leakage, reduce the insulation performance of the ceramic medium, aggravate the leakage, and cause cracking, explosion, combustion and other phenomena.
    2. Crack
      Sintering cracks are generally caused by rapid cooling during the sintering process and appear in the vertical direction of the electrode edge.
    3. Delamination
      The occurrence of delamination is often caused by poor lamination or insufficient debinding and sintering after stacking, air is mixed between layers, and jagged lateral cracks appear from external impurities. It may also be caused by a mismatch in thermal expansion after mixing different materials.
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